Semiconductor memory device

ABSTRACT

A semiconductor memory device includes a memory cell array having a plurality of memory cells arranged in a shape of a matrix along a plurality of parallel bit lines and a plurality of word lines intersecting orthogonally to the bit lines, and that have their data read out to the bit lines; a sense amplifier which detects a voltage or a current of the bit line and decides the read data from each of the memory cells; a clamping transistor connected between the sense amplifier and the bit lines to determine a voltage in a charging mode of the bit lines by a clamp voltage applied to a gate thereof; and a clamp voltage generation circuit which generates the clamp voltage so as to become larger as a distance from the sense amplifier to a selected one of the memory cells is longer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims the benefit of priorityunder 35 U.S.C. §120 from U.S. Ser. No. 13/044,657 filed Mar. 10, 2011,which is a continuation of U.S. Ser. No. 12/128,324 filed May 28, 2008(now U.S. Pat. No. 7,924,324 issued Apr. 12, 2011), and claims thebenefit of priority under 35 U.S.C. §119 from Japanese PatentApplication No. P2007-141538 filed May 29, 2007, the entire contents ofeach of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to semiconductor memory devices such asNAND cell, NOR cell, DINOR (Divided bit line NOR) cell and AND cell typeEEPROMs, and more particularly to a semiconductor memory device in whicha detection precision in a sense amplifier can be enhanced.

2. Description of the Related Art

The sense amplifier of a flash memory or the like semiconductor memorydevice decides the value of data basically by detecting the existence ornonexistence or the magnitude of a cell current which flows inaccordance with the data of a memory cell. This sense amplifier isusually connected to bit lines (data lines) to which a large number ofmemory cells are connected, and the sensing schemes thereof are broadlyclassified into a voltage detection type and a current detection type.

With the voltage detection type sense amplifier, by way of example, thebit lines in states where they are separated from the memory cells areprecharged to a predetermined voltage, the bit line is thereafterdischarged by the selected memory cell, and the discharge state of thebit line is detected at a sense node joined to the bit line. In sensingthe data, the bit line is separated from a current source load, and abit-line voltage determined by the cell data is detected. This senseamplifier scheme is usually employed in a NAND type flash memory.

On the other hand, the current detection type sense amplifier senses thedata by causing a read current to flow to the memory cell through thebit line. Also in this case, however, the bit-line voltage is determinedby the cell data, and the data decision at the sense node joined to thebit line, finally detects the difference of the voltage based on thedifference of the cell current.

In general, the voltage detection type sense amplifier and the currentdetection type sense amplifier have merits and demerits as stated below.The voltage detection type utilizes the charging and discharging of thebit lines, and hence, power consumption may be low. In a large-capacitymemory of large bit-line capacitances, however, a long time is expendedon the charging and discharging, and hence, high-speed sensing becomesdifficult. Besides, the bit-line voltage is oscillated comparativelylargely in accordance with the cell data, so that the noise between theadjacent bit lines becomes a problem.

On the other hand, the current detection type sense amplifier is capableof the high-speed sensing in such a way that the data is sensed whilecausing the read current to flow to the memory cell through the bitline. Besides, the amplitude of the bit-line voltage corresponding tothe cell data can be suppressed to a small one by a clamping transistor(pre-sense amplifier) arranged between the bit line and the sense node,so that the noise between the bit lines is difficult to becomeproblematic. In the current detection type sense amplifier, however, thepower consumption enlarges more than in the voltage detection type senseamplifier to the extent that the data is sensed while the current iskept flowing.

In the NAND type flash memory of the enlarged capacity, the voltagedetection type sense amplifier has heretofore been extensively employed.However, in a case where the capacity of the memory is enlarged more,how the high-speed sensing is performed with the power consumptionsuppressed becomes an important problem to-be-solved. Further, when themicrofabrication and capacity enlargement of the memory are advanced,the dispersion of currents attributed to the resistance values of thebit lines becomes a problem.

More specifically, in the NAND type flash memory, a read voltage Vcgwhich turns ON or OFF the selected cell in accordance with the contentof the data is applied to the control gate of the selected cell fromwhich the data is read out, among the plurality of NAND-connected memorycells. Also, a path voltage Vread which turns ON the other unselectedcells irrespective of the contents of the data is applied to the controlgates of the unselected cells. Thus, the content of the data of theselected cell is decided, depending upon if the current flows to the bitline through the memory cells. The voltage of the bit line is determinedby a voltage Vclamp which is fed to the gate of the bit-line clampingtransistor interposed between the sense amplifier and the bit line, anda voltage (Vclamp−Vthn) (where “Vthn” indicates the threshold voltage ofthe clamping transistor) is charged to the bit line. Since each celloperates in a linear region, the cell current tends to depend upon thedrain-source voltage Vds of the selected cell. The voltage of the drainside of the selected cell is determined by the voltage of the bit line,the resistance value of the bit line, and the resistance values of theunselected cells nearer to the bit line than the selected cell, within amemory cell array, while the voltage of the source side of the selectedcell is determined by the float of a source line (SRC), and theresistance values of the unselected cells nearer to the source line SRCthan the selected cell, within the memory cell array. In this regard,there has also been proposed a technique for decreasing the cell currentin such a way that the path voltage Vread which is fed to the unselectedcells between the selected cell and the source line is controlled inaccordance with the number of the unselected cells.

When the microfabrication and capacity enlargement of the memory arefurther advanced in the future, it is expected that the resistance valueof the bit line will increase more and more. When the resistance valueof the bit line increases, a dispersion occurs in the voltage of thedrain side of the selected cell between in a case where the memory cellnearer to the sense amplifier has been selected and in a case where thememory cell remoter from the sense amplifier has been selected, and thedispersion of the voltage incurs the dispersion of the cell current.That is, in the case where the selected cell is remoter from the senseamplifier, a voltage drop IR-DROP ascribable to the bit-line resistanceappears, and the voltage Vds of the selected cell decreases. As aresult, the cell current becomes small. In the worst case, there is theproblem that the read data will be erroneously decided.

BRIEF SUMMARY OF THE INVENTION

A semiconductor memory device comprising: a memory cell array whichincludes a plurality of memory cells that are arranged in a shape of amatrix along a plurality of bit lines arranged in parallel and aplurality of word lines intersecting orthogonally to the bit lines, andthat have their data read out to the bit lines; a sense amplifier whichdetects a voltage or a current of the bit line, and which decides theread data from each of the memory cells; a clamping transistor which isconnected between the sense amplifier and the bit lines, and whichdetermines a voltage in a charging mode of the bit lines by a clampvoltage applied to a gate thereof; and a clamp voltage generationcircuit which generates the clamp voltage so as to become larger as adistance from the sense amplifier to a selected one of the memory cellsis longer.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a circuit diagram of the essential portions of a NAND typeflash memory according to the first embodiment of the present invention;

FIG. 2 is a circuit diagram for explaining the operation of the memory;

FIG. 3 is a circuit diagram for explaining the operation of the memory;

FIG. 4 is a circuit diagram of the essential portions of a NAND typeflash memory according to the second embodiment of the invention;

FIG. 5 is a block diagram showing the whole configuration of the memoryof the second embodiment;

FIG. 6 is a circuit diagram of an example of a Vclamp generation circuitin the memory of the second embodiment;

FIG. 7 is a diagram showing the relations between addresses inputted tothe Vclamp generation circuit and selected blocks; and

FIG. 8 is a circuit diagram of another example of the Vclamp generationcircuit in the memory of the second embodiment.

DETAILED DESCRIPTION OF THE INVENTION First Embodiment

FIG. 1 is a circuit diagram of the essential portions of a NAND typeflash memory according to the first embodiment of the present invention.A memory cell array 10 is configured in such a way that bit lines BL areformed in a vertical line in the figure, while word lines WL are formedin a lateral direction, and that a plurality of NAND strings NS arearranged in the shape of a matrix along the bit lines BL and the wordlines WL. Each of the NAND strings NS is configured including a memorycell array in which a plurality of memory cells M0-Mn are connected inseries in such a shape that impurity regions (sources/drains) are sharedby the adjacent ones of the memory cells, and a first selection gatetransistor S1 and a second selection gate transistor S2 which arerespectively connected at both the ends of the memory cell array. Eachof the memory cells M0-Mn is made of a MOSFET in which a floating gate(charge accumulation layer) and a control gate (CG) are stacked throughan insulating film on a semiconductor substrate serving as a channelregion. The drain of the first selection gate transistor S1 is connectedto the bit line BL extending in parallel with the arrayal direction ofthe memory cells M0-Mn, and the source of the second selection gatetransistor S2 is connected to a source line SRC. The control gate ofeach of the memory cells M0-Mn constitutes the word line WL intersectingorthogonally to the bit line BL, and the gates of the selection gatetransistors S1 and S2 constitute selection gates SGD and SGSintersecting orthogonally to the bit line BL. The plurality of NANDstrings NS which are arranged in the shape of arrays in this manner, aregrouped in such a manner that one block is formed by the NAND stringsjuxtaposed in the direction of the word lines WL. That is, the memorycell array 10 is divided into m blocks (Block0-Blockm) in the directionof the bit lines BL.

A sense amplifier 11 detects the magnitude of a current flowing throughthe bit line BL to the selected memory cell Mi, from the voltage of asense node N1, so as to decide the read data of the selected memory cellMi. Either a current detection type or a voltage detection type may beemployed as the sense amplifier 11. In order to reduce bit-linecapacitance coupling noise, the sense amplifier 11 is shared by theadjacent two bit lines BLa and BLb. The sense node N1 of the senseamplifier 11 is connected to the bit line BLa through a clampingtransistor Q1 and a bit selection transistor Q2 a which are connected inseries, and it is connected to the bit line BLb through the clampingtransistor Q1 and a bit selection transistor Q2 b which are connected inseries. The clamping transistor Q1 is a transistor which determines apotential in the charging mode of the bit lines BLa and BLb, and itaffords a voltage which is obtained by subtracting the threshold voltageVthn of the transistor Q1 from a clamp voltage Vclamp applied to itsgate as a control signal BLC, to the end parts of the bit lines BLa andBLb on the sides of the sense amplifier 11. A Vclamp generation circuit12 generates the clamp voltage Vclamp on the basis of the address signalBLAD of the block in which the selected cell is included, and it feedsthe generated voltage to the gate of the clamping transistor Q1 as thegate control signal BLC. The bit-line selection transistors Q2 a and Q2b are respectively fed with voltages Vreadh and /Vreadh to their gatesas bit-line selection signals BLSa and BLSb, so as to connect either ofthe bit lines BLa and BLb to the sense amplifier 11.

Next, the operation of the data read mode of the NAND type flash memorythus configured will be explained with reference to FIGS. 2 and 3.Incidentally, FIGS. 2 and 3 show a state where the bit line BLa isselected by the bit-line selection transistor Q2 a, and the bit line BLband the NAND strings NS connected thereto are omitted from illustration.

FIG. 2 shows a case where the block Block0 nearest to the senseamplifier 11 is selected, and where data is read out from the memorycell M2 corresponding to the word line WL2 in the block Block0. In thiscase, a clamp voltage Vclamp(1) is applied as the gate control signalBLC of the clamping transistor Q1, and hence, the bit line BLa ischarged up to a voltage (Vclamp(1)−Vthn).

In the case of reading out the data from the memory cell M2 within theselected block Block0, a read voltage Vcg (for example, 0 V) whichbecomes ON or OFF in accordance with the stored data is applied to thecontrol gate of the selected memory cell M2, a read voltage Vread (forexample, about 4 V) which becomes ON irrespective of stored data isapplied to the control gates of the other memory cells M0, M1, M3, . . ., and Mn, and a voltage Vsg (for example, about 4 V) which becomes ON isapplied to the gates of the selection transistors S1 and S2. The sourceline SRC is set at 0 V. Besides, the control gates of the memory cellsM0-Mn of the unselected blocks (Block1-Blockm) are all brought intofloating states, and the selection transistors S1 and S2 are broughtinto OFF states.

In a case where data “0” is written in the selected memory cell M2 ofthe selected block Block0, the memory cell M2 exhibits a thresholdvoltage higher than the voltage Vcg, and hence, this memory cell M2keeps an OFF state, so that any current does not flow through the bitline BLa, or only a slight current flows therethrough. On the otherhand, in a case where data “1” is written in the selected memory cellM2, the memory cell M2 exhibits a threshold voltage lower than thevoltage Vcg, and hence, this memory cell M2 turns ON, so that a largecurrent flows through the bit line BLa. Thus, the potential of the sensenode N1 lowers. Accordingly, the read data is discriminated to be “1”when the potential of the sense node N1 has lowered, and it isdiscriminated to be “0” when the potential of the sense node N1 has notlowered considerably.

Here, since the selected memory cell M2 operates in a linear region, acurrent Icell₁ to flow through the selected memory cell M2 is determinedby the drain-source voltage Vds of the selected memory cell M2. Thevoltage of the drain side of the selected memory cell M2 is determinedby the voltage of the bit line BLa, the resistance value of the bit lineBLa, and the resistance values of the unselected cells M0 and M1 nearerto the bit line BLa than the selected memory cell M2, within the NANDstring NS, while the voltage of the source side of the selected memorycell M2 is determined by the float of the source line (SRC), and theresistance values of the unselected memory cells M3-Mn nearer to thesource line SRC than the selected memory cell M2, within the NAND stringNS. In the case of the example in FIG. 2, the block Block0 nearest fromthe sense amplifier 11 is selected, and hence, a voltage drop IR-DROPhardly appears due to the resistance value in the bit line BLa.Accordingly, the drain-source voltage Vds of the selected memory cell M2becomes a sufficiently large value. In this case, the clamp voltageVclamp(1) may be determined so as to limit the current value Icell₁ inconsideration of power consumption.

On the other hand, FIG. 3 shows a case where the block Blockm remotestfrom the sense amplifier 11 is selected, and where data is read out fromthe memory cell M2 corresponding to the word line WL2 within the blockBlockm. In this case, a clamp voltage Vclamp(2) is applied as the gatecontrol signal BLC of the clamping transistor Q1, and hence, the bitline BLa is charged up to a voltage (Vclamp(2)−Vthn). Incidentally,Vclamp(2)>Vclamp(1) holds here.

The operation of reading out the data of the selected memory cell M2 isthe same as in the above. In the case of the example in FIG. 3, theblock Blockm remotest from the sense amplifier 11 is selected, andhence, the resistance value RBL of the bit line BLa becomes the maximum.In this case, the clamp voltage Vclamp(2) is determined so that asufficient bit-line current Icell₂ which does not develop erroneous readmay be caused to flow. As a result, the relation of Vclamp(2)>Vclamp(1)holds.

According to this embodiment, the dispersion of that current value ofthe bit line which depends upon the position of the selected block canbe suppressed, and the reduction of the power consumption and theprevention of the erroneous read can be attained.

Second Embodiment

FIG. 4 is a circuit diagram of the essential portions of a NAND typeflash memory according to the second embodiment of the invention. Inthis embodiment, sense amplifiers 11 ₀ and 11 ₃ and sense amplifiers 11₁ and 11 ₂ are respectively arranged on both sides in the direction ofthe bit lines BL of a memory cell array 10. More specifically, the senseamplifiers 11 ₀, 11 ₁, . . . are alternately arranged on the upper endsides and lower end sides of the bit lines BL0, BL1, . . . as seen inthe figure, every second bit line. By the way, in actuality, one senseamplifier 11 is shared by the two bit lines BL, but one of the twopaired bit lines and a NAND string NU joined thereto are omitted fromillustration for the brevity of explanation.

In this embodiment, clamping transistors Q1 ₀, Q1 ₃, . . . which arerespectively connected between the sense amplifiers 11 ₀, 11 ₃, . . . onthe upper end sides of the bit lines BL and the bit lines BL0, BL3, . .. are fed with a clamp voltage Vclamp1 as a gate control signal BLC,while clamping transistors Q1 ₁, Q1 ₂, . . . which are respectivelyconnected between the sense amplifiers 11 ₁, 11 ₂, . . . on the lowerend sides of the bit lines BL and the bit lines BL1, BL2, . . . are fedwith a clamp voltage Vclamp2 as a gate control signal BLC.

According to this embodiment, in a case, for example, where data is readout from the memory cell M2 of a block Block0, the block Block0 is atthe shortest distance from the sense amplifiers 11 ₀, 11 ₃, . . . and atthe longest distance from the sense amplifiers 11 ₁, 11 ₂, . . . , andhence, the clamp voltages are set at Vclamp1<Vclamp2. Besides, in a casewhere a block (m/2) located at the middle position between the upper andlower ends of the bit lines BL has been selected, the clamp voltages areset at Vclamp1=Vclamp2, and in a case where a block Blockm located inthe vicinity of the lower ends of the bit lines BL has been selected,the clamp voltages are set at Vclamp1>Vclamp2.

Thus, the dispersion of a bit-line current value which depends upon theposition of the selected block can be suppressed, and the reduction ofpower consumption and the prevention of erroneous read can be attained.FIG. 5 is a block diagram showing the whole configuration of the NANDtype flash memory according to this embodiment. Sense amplifier/dataregister circuits 21 and 22 are respectively arranged on both sides inthe direction of the bit lines of the memory cell array 10 consisting ofthe blocks Block0-Blockm. The sense amplifier/data register circuits 21and 22 include the sense amplifiers 11, the clamping transistors Q1,bit-line selection transistors Q2, and data registers. These senseamplifier/data register circuits 21 and 22 exchange data with theexterior of the flash memory through an I/O buffer 23. That addresssignal of the memory which is fed from the exterior is stored in anaddress register 24 through the I/O buffer 23. In the address signalstored in the address register 24, a block address signal BLADconsisting of high-order bits is fed to a block selection decoder 25 andalso to a Vclamp generation circuit 26. The block selection decoder 25decodes the fed block address signal BLAD, so as to activate one of mword line drivers 27. The Vclamp generation circuit 26 generates theclamp voltages Vclamp1 and Vclamp2 corresponding to the block addresssignal BLAD, on the basis of a control signal fed from a control circuit28, and it feeds the generated clamp voltages to the clampingtransistors to the sense amplifier/data register circuits 21 and 22. Inthe address signal stored in the address register 24, a furtherhigh-order address signal in a low-order address signal is fed to a pageselection decoder 29, and the lower-order address signal is fed to acolumn decoder 30. The page selection decoder 29 activates one of theword lines WL of n memory cells M0-Mn within one block. Besides, thecolumn decoder 30 selects the bit line BL to-be-accessed in accordancewith the low-order address signal.

FIG. 6 shows a configurational example of the Vclamp generation circuit.This example is an example in which sixteen blocks Block0-Block15 areconnected to one bit line BL. Besides, FIG. 6 shows only a portion forgenerating the clamp voltage Vclamp1 in FIG. 5, and the clamp voltageVclamp1 is expressed as “Vclamp”.

A constant-voltage circuit 41 formed of a transistor which has its gateand its drain connected and which causes a constant current IREF toflow, outputs the gate voltage thereof as the clamp voltage Vclamp. Theconstant-voltage circuit 41, a variable resistor RBCL, and fifteenresistors RB are connected in series. The fifteen resistors RB have thesame resistances, respectively. A switch circuit 42 in which a pluralityof transistors Q3 are connected in the shape of a matrix, is connectedto the connection ends of the respective resistors RB and both the endsof a resistor array. The switch circuit 42 is fed with 4-bit high-orderrow address signals AROW0-AROW3 and /AROW0-/AROW3 as the block addresssignal BLAD, and it grounds any of the connection ends of the resistorsRB in accordance with the high-order row address signals AROW0-AROW3 and/AROW0-/AROW3.

As shown in FIG. 7 by way of example, in a case where the block Block0nearest to the sense amplifier/data register circuit 21 has beenselected, “1111” is inputted as the high-order row addressesAROW0-AROW3, so that the four transistors Q3 at the uppermost stage ofthe switch circuit 42 are simultaneously brought into ON states, and avoltage corresponding to (IREF×RBCL) is outputted as the clamp voltageVclamp. This is an example in which the lowest voltage is generated asthe clamp voltage Vclamp. On the other hand, in a case where the blockBlock15 remotest from the sense amplifier/data register circuit 21 hasbeen selected, “0000” is inputted as the high-order row addressesAROW0-AROW3, so that the four transistors Q3 at the lowermost stage ofthe switch circuit 42 are simultaneously brought into ON states, and avoltage corresponding to (IREF×RBCL+15×RB) is outputted as the clampvoltage Vclamp. This is an example in which the highest voltage isgenerated as the clamp voltage Vclamp. Incidentally, a circuit forgenerating the clamp voltage Vclamp2 is quite opposite in logic, and itis so configured that the clamp voltage which is generated when theblock Block0 has been selected becomes the highest value, whereas theclamp voltage which is generated when the block Block15 has beenselected becomes the lowest value.

According to this embodiment, the different values of the clamp voltageVclamp are respectively allotted to the sixteen blocks, and hence, thecurrent values of the bit lines BL can be finely controlled.

However, in a case where such a fine current control is unnecessary, asimple Vclamp generation circuit 26 can be configured as shown in FIG. 8by way of example. In this example, a switch 43 is fed with 2-bithigh-order row addresses AROW2 and AROW3, and the clamp voltage Vclampis switched in four stages in the cases where the blocks Block0-Block3,Block4-Block7, Block8-Block 11, and Block12-Block15 have been selected.Each resistor RB′ for use has a resistance value which is four times aslarge as the resistance value of each resistor RB in the circuit shownin FIG. 6.

This embodiment has the advantage that it can be configured of thesimple circuit, though it is inferior to the preceding embodiment in acontrollability for canceling the resistance components of the bit linesBL.

Incidentally, in the foregoing embodiments, the clamp voltage Vclamp islinearly changed on the basis of the block addresses, but it can also benonlinearly changed. In this case, the respective resistance values ofresistors for use may be made different, or how to select the resistorsby a switch circuit may be made nonlinear.

The sense amplifier for use in each of the embodiments may be either acurrent detection type or a voltage detection type, but the use of thesense amplifier of the current control type is more advantageous for thereason that a current control is possible.

Besides, although the NAND type flash memory has been exemplified ineach of the embodiments, the invention is not restricted to the NANDtype flash memory, but it is also applicable to semiconductor memorydevices such as NOR type, DINOR (Divided bit line NOR) type and AND typeEEPROMs.

The invention claimed is:
 1. A semiconductor memory device comprising: amemory cell array having a plurality of memory cells that are arrangedin a shape of a matrix along a plurality of bit lines arranged inparallel and a plurality of word lines intersecting orthogonally to thebit lines; a sense amplifier; a clamping transistor connected betweenthe sense amplifier and the bit lines and a clamp voltage applied to agate thereof; and a clamp voltage generation circuit generating theclamp voltage when data is read out from a selected memory cell; whereinthe memory cell array is divided into a plurality of blocks in adirection in which the bit lines extend, and m groups (m>2) include twoor more of the plurality of blocks, each of said m groups are adjacentto each other in a direction of the bit lines, and the clamp voltagegeneration circuit determines the clamp voltage on the basis of said mgroups to which the selected memory cell belongs.
 2. The semiconductormemory device according to claim 1, wherein the clamp voltage generationcircuit generating the clamp voltage so as to become larger as adistance from the sense amplifier to a selected one of the memory cellsis longer.
 3. The semiconductor memory device according to claim 2,comprising a plurality of sense amplifiers and a plurality of clampingtransistors distributively arranged, on both sides of the memory cellarray in the extending direction of the bit lines.
 4. The semiconductormemory device according to claim 3, wherein the clamp voltage generationcircuit feeds a first clamp voltage to the clamping transistor on oneside of the memory cell array, and it feeds a second clamp voltage tothe clamping transistor on the other side of the memory cell array. 5.The semiconductor memory device according to claim 1, wherein the clampvoltage generation circuit has a constant-voltage circuit and aplurality of resistors connected in series and switch circuit.
 6. Thesemiconductor memory device according to claim 5, wherein the switchcircuit has a plurality of transistors, and a gate of the plurality oftransistors is input a part of the address of the block.
 7. Thesemiconductor memory device according to claim 6, wherein the clampvoltage generation circuit decides a resistor in the plurality ofresistors, and an end of the resistor is applied to ground voltageaccording to the address of the block.
 8. The semiconductor memorydevice according to claim 6, wherein the part of the address of theblock is high-order row address.
 9. The semiconductor memory deviceaccording to claim 5, wherein the switch circuit has a plurality oftransistors connecting in series and connecting to an one end of theplurality of resistors, and a number of the plurality of transistors isless than an address size of the address of the block.
 10. Thesemiconductor memory device according to claim 1, wherein the clampvoltage generation circuit generating the clamp voltage so as to becomelarger as a distance from the sense amplifier to a selected one of thememory cells is longer.
 11. The semiconductor memory device according toclaim 1, wherein each of the plurality of blocks have NAND strings whichhave selection gate transistors and the plurality of memory cells areconnected in series between the selection gate transistors.